October 2009 - TTI, Inc., the global distributor of passive connector, electromechanical and discrete components, has announced Tyco Electronics’ new Z-PACK Slim UHD (Ultra High Density) connector series for telecommunication, router, server or switch applications. Devices are available in a standard version for data transfer rates of up to 3.5Gbps and a high speed version that can master up to 20Gbps and above. Benefiting from a highly flexible design concept, the pin assignments of the components can be adjusted to future demands.
The cost-effective connector interface is designed to support the increasing demands for higher signal density in small system slot pitches. The Z-PACK Slim UHD connector system is flexible and upgradeable and fits in 15 mm system slot pitch applications and above. The connector features an extremely high contact density (55 pins / cm2) combined with excellent signal performance.
Flexibility is achieved by giving the board designer the ability to implement pin assignments (single ended or differential, in different configurations according to the mandatory guidelines that can be found in the application specification) in such a way that they fulfill the application signal requirements for today or already for at a later point in time during the application’s project life. A 2.0 differential pair per column assignment, for example, results in 24 differential pairs per connector module. If signal speeds of over 20Gbps are specified, a 1.5 differential pair per column assignment can be selected.
Two different performance versions of the receptacle connector can make an application upgradeable, by simply exchanging daughter cards. The Common Speed (CS) version can be used for signal speeds up to about 3.5 Gbps, while the High Speed (HS) version is capable of operating at over 20Gbps. Both receptacle versions have identical envelope dimensions and mate with a uniform header connector. In that way, customers do not have to buy an expensive high speed connector if the application does not initially require high speed signaling during an early phase development. Later, when signal speeds need to increase, daughter cards can be exchanged with ones equipped with high speed connectors, but crucially, the backplane does not require any changes.
The low profile and high density allows designers to reduce the board spacing between adjacent daughter cards in a rack, making room for more cards or reducing the size of the application. Z-PACK Slim UHD connectors can also assist in thermal management within the system by creating less obstruction to cooling airflow. The overmoulded signal contacts on the receptacle, in combination with the plastic ribs embedded in the header design, result in a reliable and highly protected interconnect solution.
The product family consists of a right-angle receptacle, vertical header and guiding modules. In addition to that, the Z-PACK Slim UHD connector series has been completed with a right-angle header (coplanar) and power modules.
Comments John Sandy, TTI’s Supplier Marketing Director Connectors, Relay & Switches -Europe: “Tyco Electronics’ new Z-PACK Slim UHD connector shows that it is possible to design a miniature connector capable of transmitting data very quickly and offering a very long service life. The additional benefit that the components’ pin assignments can be adjusted for the demands of future applications makes it a highly desirable new board-to-board interconnect solution.“
About TTI, Inc.
TTI’s philosophy is "Lead by Design", and the company differentiates itself by focusing on people, parts and process. TTI, Inc. is a specialty distributor of passive, interconnect and discrete components. The company has developed a policy in Europe of being the distributor of choice for customers and suppliers alike by introducing new product technologies from key supply partners to its customers - and by stocking broad and deep across its franchise base. TTI also operates sophisticated inventory management processes which ensure that it has the ability to service changes in component demand due to fluctuating markets and supply chains.