MOSFETs FJ3P0210/FK3P0211 – Power CSP MOSFETs

Panasonic

The new power CSP MOSFET Series features Power Mount CSP Packaging (PMCP) that is comprised of a unique pad design and drain clip technology.

The new power CSP MOSFET Series features Power Mount CSP Packaging (PMCP) that is comprised of a unique pad design and drain clip technology. This allows for a 5% improvement in thermal dissipation while simultaneously reducing the size by 80% over the conventional solutions. Panasonic’s advances in cell technology and wafer thinning fabrication have lead to silicon with a 110nm fine trench cell that provides 47% lower RDS(on) over the same sized conventional chip. By using this technology, this MOSFET Series achieves higher power efficiency while reducing power consumption.

Features

  • Power Mount CSP (PMCP) package allows for Improved thermal dissipation by 5% while reducing the size by 80% over the conventional solutions
  • Employing a fine trench silicon technology that provides 47% lower RDS(on) over the same sized conventional chip by using this technology, this MOSFET family achieves higher power efficiency while reducing power consumption of the system
  • Size: FJ3P02100L: 2.0 x 2.0 x 0.33mm FK3P02110L: 1.8 x 1.6 x 0.33mm
  • RDS(on): FJ3P02100L: 9.5mO@VGS=4.5V(typ.) FK3P02110L: 12.5mO@ VGS=2.5V(typ.)
  • Lead-free solder bumps, halogen free, RoHS qualified
  • AEC-Q101 qualified
  • High power density and better efficiency minimize board space while increasing efficiency and thermal dissipation
  • Lower power consumption industry leading low RDS(on) for load switch
  • Dampen excessive ringing and overshoot the clip structure rather than wire-bonds is more effective to reduce the parasitic inductance

Applications

  • Portable audio players/gaming devices/handsets /IC recorders
  • Blood glucose monitors/hearing aids
  • IC cards
  • Meters
  • Adapters
  • Tablet PCs/ E-Books
  • Servers/routers

Resources