SiHH26N60E / E Series Power MOSFETs

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Power MOSFETs in PowerPAK® 8 x 8 package with Kelvin Source Connection for increased performance.

The new Vishay SiHH26N60E, SiHH21N60E, SiHH14N60E, and SiHH11N60E all feature a large drain terminal for low thermal resistance and a Kelvin source connection that can increase efficiency by improving the gate drive signal. Their new low-profile, surface-mount PowerPAK 8x8 package is RoHS-compliant, halogen-free and 100% lead (Pb)-free and provides a space-saving alternative to conventional TO-220 and TO-263 solutions.

The construction of the package allows one of the source pins to be arranged as a dedicated Kelvin source connection that separates the gate drive return path from the main current-carrying source terminals. This prevents the L x di / dt voltage drop in the high-current path from reducing the gate drive voltage that is applied to the E Series MOSFETs. This leads to faster switching and more noise immunity in power supply designs for telecom, server, computing, lighting, and industrial applications.

Built on Vishay's latest energy-efficient E Series superjunction technology, the products feature low on-resistance down to 0.135Ω at 10V, ultra-low gate charge down to 31nC, and low gate charge times on-resistance, a key figure of merit (FOM) for MOSFETs used in power conversion applications. These values translate into extremely low conduction and switching losses to save energy in power factor correction, flyback converters, and two-switch forward converters for server and telecom power supplies, HID and fluorescent ballast lighting, consumer and computing power adaptors, motor drives, solar PV inverters, induction heating, and welding equipment.


◾Based on E Series superjunction technology for hard-switched topologies
◾600V, 26A maximum, RDS(on) max. of 135mΩ
◾Kelvin source connection for reduced gate ground loop resulting in increased Performance
◾PowerPAK® 8 x 8 footprint is 57% smaller and profile is 1/5 the height of the TO-263 (D2PAK) package
◾Meets the 1.5mm minimum creepage and clearance specifications for 600V and 650V devices (Pollution Degree II and Material Group II)
◾Fully RoHs-compliant with halogen-free mold compound


◾Hard-switching (focus) topologies (PFC, two-switch forward, flyback)
◾Consumer electronics
◾Telecommunications (servers)
◾Computers (ATX / silver box SMPS)