LPAM - Board to Board & Mezzanine Connectors
77 ResultsPart | Availability | Purchasing | RoHS/Lead | Product | Number of Positions | Pitch | Number of Rows | Termination Style | Mounting Angle | Stack Height | Current Rating | Voltage Rating | Maximum Data Rate | Minimum Operating Temperature | Maximum Operating Temperature | Contact Plating | Contact Material | Housing Material | Series | Packaging |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors .050 LP ARRAY HIGH-SPEED HIGH- | 0In Stock | Headers | 400 Position | 1.27 mm (0.05 in) | 8 Row | Crimp | Vertical | 4 mm, 4.5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 1.27MM HIGH DENSITY LP 8ROW | 0In Stock | Headers | 320 Position | 1.27 mm (0.05 in) | 8 Row | Crimp | Vertical | 4.5 mm, 5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 1.27MM HIGH DENSITY LOW PROFIL | 0In Stock | Headers | 180 Position | 1.27 mm (0.05 in) | 6 Row | Crimp | Vertical | 4 mm, 4.5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Plugs | 120 Position | 1.27 mm (0.05 in) | 4 Row | Crimp | Straight | 2.2 A | 250 VAC | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 80 Position | 1.27 mm (0.05 in) | 4 Row | Solder | Straight | 2.2 A | 250 VAC | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | LPAM | Reel | |||||||||||||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 1.27 mm (0.05 in) | Solder | Straight | 2.2 A | 250 V | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 1.27 mm (0.05 in) | Solder | Straight | 2.2 A | 250 V | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 120 Position | 1.27 mm (0.05 in) | 4 Row | Crimp | Vertical | 4.5 mm, 5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | LPAM | Reel | |||||||||||||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 40 Position | 1.27 mm (0.05 in) | 4 Row | Crimp | Vertical | 4 mm, 4.5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 320 Position | 1.27 mm (0.05 in) | 8 Row | Crimp | Vertical | 4 mm, 4.5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 1.27 mm (0.05 in) | Solder | Straight | 2.2 A | 250 V | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 240 Position | 1.27 mm (0.05 in) | 6 Row | Crimp | Vertical | 4 mm, 4.5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | LPAM | Reel | |||||||||||||||||
TTI: Not Assigned Samtec Availability: 0In Stock325 Factory Stock Can Ship 10 Days Board to Board & Mezzanine Connectors | 0In Stock325 Factory Stock Can Ship 10 Days | Headers | 240 Position | 1.27 mm (0.05 in) | 8 Row | Crimp | Vertical | 4 mm, 4.5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | LPAM | Reel | |||||||||||||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 320 Position | 1.27 mm (0.05 in) | 8 Row | Crimp | Vertical | 4 mm, 4.5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | LPAM | Reel | |||||||||||||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 160 Position | 1.27 mm (0.05 in) | 8 Row | Crimp | Vertical | 4.5 mm, 5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 180 Position | 1.27 mm (0.05 in) | 6 Row | Crimp | Vertical | 4.5 mm, 5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 320 Position | 1.27 mm (0.05 in) | 8 Row | Crimp | Vertical | 4.5 mm, 5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array | 0In Stock | LPAM | ||||||||||||||||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | Headers | 80 Position | 1.27 mm (0.05 in) | 4 Row | Crimp | Vertical | 4.5 mm, 5 mm | 2.2 A | 250 VAC | 28 Gbps | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel | ||
Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 1.27MM HIGH DENSITY LOW PROFIL | 0In Stock | Headers | 1.27 mm (0.05 in) | Solder | Straight | 2.2 A | 250 V | - 55 C | + 125 C | Gold | Copper Alloy | Liquid Crystal Polymer (LCP) | LPAM | Reel |
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- + $7.00 Per Reel