Reference Only

470-2105-100

Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls.

Manufacturer:

Mfr Part:
470-2105-100

TTI Part:
Not Assigned

EDA / CAD Models

Specifications

DescriptionProduct Attribute
Similar
ManufacturerAmphenol
Product CategoryBoard to Board & Mezzanine Connectors
ProductReceptacles
Number of Positions200 Position
Pitch1.15 mm (0.045 in)
Number of Rows20 Row
Termination StyleBGA
Mounting AngleVertical
Stack Height13 mm, 15 mm, 17 mm, 20 mm
Current Rating1 A
Voltage Rating600 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 105 C
Contact PlatingGold
Contact MaterialCopper Alloy
Housing MaterialLiquid Crystal Polymer (LCP)
SeriesNeXLev
PackagingTray
Product TypeBoard to Board & Mezzanine Connectors
SubcategoryBoard to Board & Mezzanine Connectors
TradenameNeXLev

Export and Environmental Classification

AttributeDescription
ECCNEAR99
HTS8536694040
TARIC8536693000
RoHS CompliantRoHS Per Exemption
RoHS Per Exemption
RoHS Exemption NumberN/A
Lead(PB) in TerminalsCall to Verify PB
REACH SVHCNo
REACH Substance NameN/A

Documents

EDA / CAD Models

0In Stock

Available For Backorder
Lead Time: 26 Weeks
Please adjust quantity to minimum and multiple values.
Quantity
---
Unit Price
---
Ext. Price
---

Tray

(Minimum: 72 / Multiples: 24)
Quantity Unit PriceExt. Price
99,70 €7.178,40 €
Need more?