Reference Only

470-3155-600

Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls.

Manufacturer:

Mfr Part:
470-3155-600

TTI Part:
Not Assigned

EDA / CAD Models

Specifications

DescriptionProduct Attribute
Similar
ManufacturerAmphenol
Product CategoryBoard to Board & Mezzanine Connectors
ProductReceptacles
Number of Positions300 Position
Pitch1.15 mm (0.045 in)
Number of Rows30 Row
Termination StyleBGA
Mounting AngleVertical
Stack Height18 mm, 20 mm, 22 mm, 25 mm
Current Rating1 A
Voltage Rating600 V
Maximum Data Rate12.5 Gbps
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 105 C
Contact PlatingGold
Contact MaterialCopper Alloy
Housing MaterialLiquid Crystal Polymer (LCP)
SeriesNeXLev
PackagingTray
Data Rate12.5 Gbps
Product TypeBoard to Board & Mezzanine Connectors
SubcategoryBoard to Board & Mezzanine Connectors
TradenameNeXLev

Export and Environmental Classification

AttributeDescription
ECCNEAR99
HTS8536694040
TARIC8536693000
RoHS CompliantYes
RoHS Compliant
RoHS Exemption NumberN/A
Lead(PB) in TerminalsCall to Verify PB
REACH SVHCNo
REACH Substance NameN/A

Documents

EDA / CAD Models

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Tray

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