Laird Technologies Tflex SF Non-Silicone-Based Gap Fillers
Laird Tflex SF Non-Silicone-Based Gap Fillers provide thermal interface materials with excellent deflection properties and low contact resistance. These gap fillers feature non-silicone formulations, low peak and residual pressure, excellent surface wetting, and exceptionally low thermal resistance. The SF gap fillers feature a maximum thermal conductivity of 10W/mk and a maximum operating temperature of +125°C. These components have a maximum density of 3.7g/cc and a maximum dielectric breakdown voltage of 7.9kV/mm. Typical applications include automotive electronics, ADAS, ECUs, routers, servers, optical modules, wireless infrastructure, drones, satellites, and consumer electronics.
Features
- Environmentally friendly solution
- Excellent surface wetting for low contact resistance
- Exceptionally low thermal resistance
- Low peak and residual pressure
- No fiberglass reinforcement
- Non-silicone based formulation
- REACH compliant
- RoHS compliant
- UL V0 flammability rating
Applications
- Advanced Driver Assistance Systems (ADAS)
- Automotive electronics and infotainment
- Consumer electronics
- Drones and satellites
- Optical modules
- Powertrain and ECUs
- Routers
- Servers
- Wireless infrastructure
Technical Specifications
| Parameters | Values | ||
|---|---|---|---|
| SF4 | SF7 | SF10 | |
| Thermal Conductivity | 4W/mK | 7.8W/mK | 10W/mK |
| Operating Temperature Range | -65°C to +125°C | -65°C to +125°C | -40°C to +125°C |
| Density | 3.1g/cc | 3.4g/cc | 3.7g/cc |
| Dielectric Breakdown Volatge | 7.5kV/mm | 7.9kV/mm | 7.5kV/mm |
| Thickness Range | 0.5mm to 4mm | 0.5mm to 4mm | 0.5mm to 5mm |
Tflex SF10 Pressure vs. Deflection
