Molex HSAutoLink Connectors

Molex HSAutoLink Interconnect System is a USCAR-30–compliant, point-to-point solution engineered to ensure high signal integrity. These systems enable protocols such as USB 2.0, LVDS, Ethernet, and A2B, and offer data rates up to 2.0Gbps. The HSAutoLink interconnect system offers a maximum current of 1.5A and an operating temperature range from -40°C to +105°C. Typical applications include cameras, infotainment systems, telematics systems, agricultural vehicles, and compute modules.

Features

• Enables multi-protocol connector support
• Ensures superior signal integrity
• Meets JEDEC 260°C requirements
• Supports high-density device designs
• Supports versatile, error-free assembly
• Withstands high-temperature environments

Applications

• Agricultural vehicles 
• Automotive:
  • Advanced driver assistance systems (ADAS) 
  • Cameras
  • Compute modules 
  • Infotainment systems 
  • Multimedia devices 
  • Rear-seat entertainment systems 
  • Telematics systems 

Technical Specifications