Molex Sentrality High-Current Pin and Socket Interconnect Systems
Molex Sentrality High-Current Pin and Socket Interconnect Systems are self-aligning high-voltage board-to-board, busbar-to-busbar, and busbar-to-board connectors with low contact resistance. These connector systems are available in a wide range of mating configurations and four sizes (3.4mm, 6mm, 8mm, and 11mm). The connector systems operate over a temperature range from -40°C to +125°C and a current rating of up to 350A. These connectors use a unique design that minimizes potential damage during mating by allowing for up to 1mm of radial self-alignment. Sentrality pin and socket interconnect systems find use in telecom, electric vehicle, and supercomputer applications.
Features
- Allows for design and manufacturing flexibility
- Allows for stacking of substrates
- Allows for tighter board-to-board stack heights with shorter socket assemblies
- Easily customizable
- Ensures correct placement of pin and socket assemblies
- Low contact resistance and minimal heat generation
- Mitigates tolerance stack-up issues
- Prevents contact beam deformation with freely moving socket
Applications
- Home energy storage
- Battery storage systems
- Gateway storage systems
- Industrial automation
- AC-to-DC rectifiers
- Battery charging stations
- DC-to-AC inverters
- Robotics
- Networking
- Data storage units
- Enterprise switches
- Environmental control equipment
- Power Distribution Unit (PDU)
- Power shelves
- Servers
- Uninterruptable power supplies (UPS)
- Telecommunications
- Data storage units
- Digital cross-connect switches
- Network routers
- Power Distribution Unit (PDU)
- Servers
- Uninterruptable power supplies (UPS)
Technical Specifications
| Parameters | Values |
|---|---|
| Current rating range | 75A to 350A |
| Pin sizes | 3.40mm, 6.00mm, 8.00mm and 11.00mm |
| Voltage | 1000V |
| Operating temperature range | -40°C to +125°C |
| Maximum contact resistance | 0.25mΩ (3.40mm) 0.20mΩ (6.00mm and 8.00mm) 0.40mΩ (11.00mm) |
Video
This TTI tech specs video for Molex Sentrality High-Current Pin and Socket Interconnect System explains that they offer high-current board-to-board, busbar-to-board, and busbar-to-busbar connectors and provide a ±1.00mm radial self-alignment to overcome tolerance stack-up issues.
See video transcript below
Video Transcript
Imagine this: you need to connect two different boards together via a stack, and you need to share 350A at 600V with multiple mating cycles and alignment pins. Not your typical application, but the Molex Sentrality High-Current Pin and Socket Interconnect System isn’t typical. These connectors are compact and utilize a wide capture area, giving them a 1mm self-alignment capability. They can handle currents up to 350A, and a maximum contact resistance of 0.4mΩ significantly reduces energy loss. They’re offered in pin sizes up to 11mm for the toughest challenges, and all connectors support a minimum of 200 mating cycles. That way you can take things apart and put them back together all you want without affecting the performance of these connectors.
