The TE Connectivity AMPMODU MTE interconnection system is utilized in wire-to-board and wire-to-wire applications, and can be found in many types of electronic equipment including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls. The product implements Insulation Displacement Contacts (IDC) or Crimp Snap-In contacts to suit customer’s needs.
TE Connectivity and AMPMODU are trademarks.