Laird Technologies Tflex SF10 Thermal Gap Fillers
Laird Tflex SF10 Series Non-Silicone Based Thermal Gap Fillers are high-performance thermal materials designed to enhance heat dissipation in electronic applications. These thermal gap fillers provide a thermal conductivity of 10W/mk and exceptional thermal management while maintaining low peak and residual pressure on components. The Tflex SF10 fillers are available in thicknesses ranging from 0.5mm to 5mm and ensure excellent surface wetting for minimal contact resistance. These gap fillers are compliant with RoHS and REACH regulations and are ideal for various applications such as medical, industrial, and consumer electronics.
Features
- Custom sizes and thicknesses can be provided
- Excellent surface wetting for optimal contact
- Low pressure and thermal resistance
- Non-silicone formulation for enhanced compatibility
- RoHS and REACH compliant
- UL flammability rating of V-0 for fire safety
Applications
- Automotive components
- Battery packs
- Consumer electronics
- Industrial machinery
- LED lighting
- Medical devices
- Power electronics
- Telecommunications
Technical Specifications
| Parameters | Values |
|---|---|
| Operating Temperature Range | -40°C to +125°C |
| Thickness Range | 0.5mm to 5mm |
| Thermal Conductivity | 10W/mk |
| Density | 3.7g/cc |
| Dielectric Constant at 1MHz | 9 |
Tflex SF10 Pressure vs. Deflection
