Laird Technologies Tflex SF7 and SF4 Thermal Gap Fillers

Laird Performance Materials Tflex SF4 and SF7 Silicone Free Thermal Gap Fillers are designed to manage heat without contaminating sensitive components. These devices compress easily under low pressure, maintaining mechanical integrity while minimizing stress on delicate assemblies. The SF7 and SF4 maintain superior surface wetting, ensuring efficient thermal transfer between uneven surfaces. These components come with a thickness range from 0.5mm to 4mm and an operating temperature range from -65°C to +125°C. Typical applications include automotive control units, telecom infrastructure, aerospace electronics, and industrial power systems.

Features

  • High deflection properties
  • High performance
  • Low contact resistance
  • Low peak and residual pressure
  • Low thermal resistance
  • RoHS and REACH compliant
  • Silicone free
  • UL V-0 flammability rating
  • Wide operating temperature range

Applications

  • Aerospace electronics
  • Automotive control units
  • Data centers
  • Industrial power systems
  • Telecom infrastructure

Technical Specifications

Parameters Values
Thickness Range 0.5mm to 4mm
Thermal Conductivity 4W/mK and 7.8W/mK
Operating Temperature Range -65°C to +125°C
Density 3.1g/cc and 3.4g/cc
Dielectric Breakdown Voltage 7.5kV/mm and 7.9kV/mm
Laird Performance Materials Tflex SF7 and SF4 Thermal Gap Fillers
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