HellermannTyton Heat Shrinkable Moulded Shapes
HellermannTyton Heat Shrinkable Moulded Shapes simplify installation and provide a heat shrink ratio of up to 5:1. These devices maintain high dielectric strength, mechanical durability, and strong resistance to chemicals and harsh environments. The heat shrinkable moulded shapes ensure insulation and protection for electronic components and support component fabrication. These moulded shapes are available in multiple sizes, materials, and adhesive options. Applications include automotive, aerospace, telecommunications, and defense systems.
Features
- Compliance with VG styles
- Custom material and adhesive combinations for specific needs
- Excellent dielectric strength and mechanical toughness
- High heat shrink ratio (up to 5:1)
- Low-profile, bulbous, convolute, straight, and right-angle boots
- Resistance to chemicals and harsh environmental conditions
- Strain-relief options for various connector types
Applications
- Aerospace industry
- Automotive systems
- Consumer electronics
- Defense systems
- Electronics and electrical components
- Medical devices
- Oil and gas industry
- Telecommunications
- Wire and cable management
Technical Specifications
| Parameters | Values |
|---|---|
| Maximum shrink ratio | 5:1 |
| Operating temperature range | -55°C to +200°C |
| Minimum shrink temperature range | +135°C to +175°C |
| Dielectric strength range | 0.8KV/mm to 20kV/mm |
| Tensile strength range | 12MPa to 15MPa |
| Elongation at break range | 300% to 610% |
