Miniaturization in Automotive Technology
Today’s engineers are facing challenges to streamline their designs and embrace miniaturization in the automotive industry. Leveraging solutions to make automotive systems smaller, lighter and slimmer without compromising longevity and performance is key.
Molex’s advanced miniaturization technologies empower automotive manufacturers to push the boundaries of efficiency and performance. TTI and Molex stay ahead of the curve by delivering solutions that ensure rugged and reliable connections – designed to accommodate space constraints.
MX-DaSH Series Wire-to-Wire Connector System
Molex MX-DaSH Series Wire-to-Wire Connector System combines high-speed data, signal, and power into a single connector, eliminating the need for multiple traditional connectors. These connectors reduce weight and size while simplifying assembly operations. The MX-DaSH series operates within a temperature range from -40°C to +120°C, offers a minimum insulation resistance of 100MΩ, and supports a maximum voltage of 250V. These devices operate within a frequency range from 20Hz to 200Hz and support a maximum mating force of 70N. Typical applications include autonomous driving modules, computing modules, GPS devices, sensor connectivity, and LiDAR systems.
DuraClik
Mini50 Connector
Systems
Mizu-P25 Sealed Connectors
StAK50h Automotive Connectors
MX64 Sealed Connectors
Mirror Mezz & Mirror Mezz Pro Connectors
SlimStack Board-to-Board Connectors
Easy-On FFC FPC Connectors
Antenna Solutions
Pico-Clasp Wire-to-Board Connectors
Micro-Lock Plus Wire-to-Board Connector System
CLIK-Mate Connectors
Compactus Connectors
Solution Guide
